Part Details | LAPPING AND GRINDING COMPOUND
5350-00-276-5858 An abrasive grain in a suitable liquid or semiliquid carrier, sometimes known as vehicle or binder, intended for use in hand or machine removal of small quantities of material to close tolerances.
Alternate Parts: 60375, 6-0-375, HYPREZ OS DIAMOND COMPOUND, 5350-00-276-5858, 00-276-5858, 5350002765858, 002765858
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 53 | JAN 01, 1963 | 00-276-5858 | 02605 ( LAPPING AND GRINDING COMPOUND ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5350-00-276-5858
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 6-0-375 | 20566 | ENGIS CORPORATION |
| HYPREZ OS DIAMOND COMPOUND | 20566 | ENGIS CORPORATION |
Technical Data | NSN 5350-00-276-5858
| Characteristic | Specifications |
|---|---|
| ABRASIVE MATERIAL | DIAMOND POWDER |
| USAGE DESIGN | METAL WORKING |
| ABRASIVE DIAMOND POWDER CONCENTRATION DESIGNATION | MEDIUM |
| COMPOUND WEIGHT | 5 GRAMS |
| ABRASIVE LUBRICANT TYPE | OIL |