Part Details | ADHESIVE
8040-01-007-9151 A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes CANADA BALSAM; CEMENT, WATCH JEWEL; FILM CEMENT, PHOTOGRAPHIC; GASKET CEMENT; and GASKET SHELLAC COMPOUND.
Alternate Parts: 58129, 581-29, 500105840029, 50-01-0584-0029, CHOBOND 58429, CHO-BOND 584-29, 8040-01-007-9151, 01-007-9151, 8040010079151, 010079151
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 80 | AUG 10, 1975 | 01-007-9151 | 11297 ( ADHESIVE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 8040-01-007-9151
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 581-29 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
| 50-01-0584-0029 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
| CHO-BOND 584-29 | 18565 | PARKER-HANNIFIN CORPORATIONDBA PARKER CHOMERICS DIV |
Technical Data | NSN 8040-01-007-9151
| Characteristic | Specifications |
|---|---|
| MATERIAL | PLASTIC EPOXY |
| SPECIFIC USAGE DESIGN | FOR ELECTRONICS BONDING APPLICATIONS |
| COLOR | GRAY |
| PHYSICAL FORM | PASTE |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 1.000 POUNDS |
| SPECIAL FEATURES | SILVER FILLED; ELECTRICALLY CONDUCTIVE; ROOM TEMPERATURE CURE |
| SUPPLEMENTARY FEATURES | 1 POUND KIT |