Part Details | ADHESIVE
8040-01-603-7992 A substance compounded for binding materials together by surface attachment. It is not used primarily to fill voids or pores or for sealing purposes. Excludes CANADA BALSAM; CEMENT, WATCH JEWEL; FILM CEMENT, PHOTOGRAPHIC; GASKET CEMENT; and GASKET SHELLAC COMPOUND.
Alternate Parts: HYSOL FP6101, FP6101, 506975, 8040-01-603-7992, 01-603-7992, 8040016037992, 016037992
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 80 | MAR 15, 2012 | 01-603-7992 | 11297 ( ADHESIVE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 8040-01-603-7992
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| HYSOL FP6101 | 04347 | HENKEL LOCTITE CORP |
| FP6101 | 04347 | HENKEL LOCTITE CORP |
| 506975 | 04347 | HENKEL LOCTITE CORP |
Technical Data | NSN 8040-01-603-7992
| Characteristic | Specifications |
|---|---|
| MATERIAL | PLASTIC EPOXY |
| SPECIFIC USAGE DESIGN | FOR UNDERFILLING CHIP SCALE PACKAGES (CSPS) AND BALL GRID ARRAYS (BGAS) ON CIRCUIT BOARDS |
| CURING METHOD | HEAT |
| COLOR | BLACK |
| PHYSICAL FORM | PASTE |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 10.000 MILLILITERS |
| SPECIAL FEATURES | PREMIXED AND FROZEN; UNFILLED; FLEXIBLE; REMOVABLE; ELEVATED TEMPERATURE CURE, 5 TO 10 MINUTES AT 150 DEG C; MUST BE SHIPPED AND STORED AT MINUS 40 DEG C OR BELOW |
| SUPPLEMENTARY FEATURES | 10 MILLILITER SYRINGE |